Intel EP20K400EFC672-3

EP20K400EFC672-3 Intel
EP20K400EFC672-3
Intel

Product Information

HTSUS:
8542.39.0001
RoHS Status:
RoHS non-compliant
DigiKey Programmable:
Not Verified
Number of I/O:
488
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
672-BBGA
Number of Logic Elements/Cells:
16640
REACH Status:
REACH Unaffected
Total RAM Bits:
212992
edacadModelUrl:
/en/models/703810
Package:
Tray
Moisture Sensitivity Level (MSL):
3 (168 Hours)
Number of LABs/CLBs:
1664
Mounting Type:
Surface Mount
Number of Gates:
1052000
Series:
APEX-20KE®
Supplier Device Package:
672-FBGA (27x27)
Voltage - Supply:
1.71V ~ 1.89V
ECCN:
3A001A7A
Base Product Number:
EP20K400
edacadModel:
EP20K400EFC672-3 Models
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This is manufactured by Intel. The manufacturer part number is EP20K400EFC672-3. It is assigned with possible HTSUS value of 8542.39.0001. The product is rohs non-compliant. 488 is the I/O value of the product. The product has 0°c ~ 85°c (tj) operating temperature range. Moreover, the product comes in 672-bbga. The product contains 16640 logic cells/elements. In addition, it is reach unaffected. It include a total of 212992 RAM bits. It is shipped in tray package . Its typical moisture sensitivity level is 3 (168 hours). It consists of 1664 CLBs/LABs. The product is available in surface mount configuration. It contains 1052000 gates. The product apex-20ke®, is a highly preferred choice for users. 672-fbga (27x27) is the supplier device package value. It has optimum voltage supply of 1.71v ~ 1.89v. The product is designated with the 3a001a7a code number. Moreover, it corresponds to ep20k400, a base product number of the product.

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Wafer Bump Transfer 06/Feb/2015(PCN Assembly/Origin)
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Virtual JTAG Megafuntion Guide(Manuals)
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Mult Series Software Chgs 26/Mar/2020(PCN Design/Specification)
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EOL 01/Dec/2016(PCN Obsolescence/ EOL)
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EOL 21/Nov/2016(PCN Obsolescence/ EOL)
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APEX 20K Family Datasheet(Datasheets)
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All Dev Pkg Chg 1/Aug/2018(PCN Packaging)
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Mult Dev Dessicant Chg 19/Jul/2019(PCN Packaging)

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FAQs

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