Intel EP3C5E144I7

EP3C5E144I7 Intel
Intel

Product Information

HTSUS:
8542.39.0001
RoHS Status:
RoHS non-compliant
DigiKey Programmable:
Not Verified
Number of I/O:
94
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
144-LQFP Exposed Pad
Number of Logic Elements/Cells:
5136
REACH Status:
REACH Unaffected
Total RAM Bits:
423936
edacadModelUrl:
/en/models/1823473
Package:
Tray
Moisture Sensitivity Level (MSL):
3 (168 Hours)
Number of LABs/CLBs:
321
Mounting Type:
Surface Mount
Series:
Cyclone® III
Supplier Device Package:
144-EQFP (20x20)
Voltage - Supply:
1.15V ~ 1.25V
ECCN:
3A991D
Base Product Number:
EP3C5
edacadModel:
EP3C5E144I7 Models
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This is manufactured by Intel. The manufacturer part number is EP3C5E144I7. It is assigned with possible HTSUS value of 8542.39.0001. The product is rohs non-compliant. 94 is the I/O value of the product. The product has -40°c ~ 100°c (tj) operating temperature range. Moreover, the product comes in 144-lqfp exposed pad. The product contains 5136 logic cells/elements. In addition, it is reach unaffected. It include a total of 423936 RAM bits. It is shipped in tray package . Its typical moisture sensitivity level is 3 (168 hours). It consists of 321 CLBs/LABs. The product is available in surface mount configuration. The product cyclone® iii, is a highly preferred choice for users. 144-eqfp (20x20) is the supplier device package value. It has optimum voltage supply of 1.15v ~ 1.25v. The product is designated with the 3a991d code number. Moreover, it corresponds to ep3c5, a base product number of the product.

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Mult Dev Assembly/BOM Rev 13/Mar/2020(PCN Assembly/Origin)
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Virtual JTAG Megafuntion Guide(Manuals)
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Mult PN LABEL 01/08/2023(PCN Design/Specification)
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Mult Series Software Chgs 26/Mar/2020(PCN Design/Specification)
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Leaded FPGA/CPLD EOL 15/Jan/2024(PCN Obsolescence/ EOL)
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Cyclone III Family Overview(Datasheets)
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Cyclone III Brochure(Datasheets)
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Cyclone III Device Handbook Vol2(Datasheets)
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Mult Dev Label Chgs 24/Feb/2020(PCN Packaging)
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Mult Dev Label CHG 24/Jan/2020(PCN Packaging)

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