Intel EP2S60F672C3N

EP2S60F672C3N Intel
EP2S60F672C3N
Intel

Product Information

HTSUS:
8542.39.0001
RoHS Status:
RoHS Compliant
Package / Case:
672-BBGA
Number of I/O:
492
Operating Temperature:
0°C ~ 85°C (TJ)
DigiKey Programmable:
Not Verified
REACH Status:
REACH Unaffected
edacadModel:
EP2S60F672C3N Models
edacadModelUrl:
/en/models/1084782
Number of Logic Elements/Cells:
60440
Moisture Sensitivity Level (MSL):
3 (168 Hours)
Total RAM Bits:
2544192
Number of LABs/CLBs:
3022
Mounting Type:
Surface Mount
Series:
Stratix® II
Supplier Device Package:
672-FBGA (27x27)
Packaging:
Tray
Voltage - Supply:
1.15V ~ 1.25V
Base Product Number:
EP2S60
ECCN:
3A991D
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This is manufactured by Intel. The manufacturer part number is EP2S60F672C3N. It is assigned with possible HTSUS value of 8542.39.0001. The product is rohs compliant. Moreover, the product comes in 672-bbga. 492 is the I/O value of the product. The product has 0°c ~ 85°c (tj) operating temperature range. In addition, it is reach unaffected. The product contains 60440 logic cells/elements. Its typical moisture sensitivity level is 3 (168 hours). It include a total of 2544192 RAM bits. It consists of 3022 CLBs/LABs. The product is available in surface mount configuration. The product stratix® ii, is a highly preferred choice for users. 672-fbga (27x27) is the supplier device package value. In addition, tray is the available packaging type of the product. It has optimum voltage supply of 1.15v ~ 1.25v. Moreover, it corresponds to ep2s60, a base product number of the product. The product is designated with the 3a991d code number.

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Mult Dev Add Subs 6/Sep/2019(PCN Obsolescence/ EOL)
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Mult Dev EOL 4/Dec/2020(PCN Obsolescence/ EOL)
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Mult Devices Assembly Site 19/Apr/2019(PCN Assembly/Origin)
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Virtual JTAG Megafuntion Guide(Manuals)
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Mult Series Software Chgs 26/Mar/2020(PCN Design/Specification)
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Readiness Plan Update 3/Apr/2020(PCN Other)
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Stratix II Device Handbook(Datasheets)
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Mult Dev Status Rev 4/Dec/2020(PCN Part Status Change)
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Mult Dev Label Chgs 24/Feb/2020(PCN Packaging)
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Mult Dev Label Chgs 15/Apr/2024(PCN Packaging)

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