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Seeed Technology Co., Ltd 113990007

113990007 Seeed Technology Co., Ltd
Seeed Technology Co., Ltd

Product Information

Function:
Breakout Board, Bluetooth
Utilized IC / Part:
-
HTSUS:
8534.00.0040
Package:
Bulk
Series:
-
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Platform:
LaunchPad™
Type:
Connectivity
Contents:
Board(s)
ECCN:
EAR99
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This is manufactured by Seeed Technology Co., Ltd. The manufacturer part number is 113990007. It performs basic function of breakout board, bluetooth. It is assigned with possible HTSUS value of 8534.00.0040. It is shipped in bulk package . Its typical moisture sensitivity level is 1 (unlimited). Platform Info: launchpad™. It comes in connectivity configuration. Contents Include: board(s). The product is designated with the ear99 code number.

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HHW-SPP Bluetooth Module AT Commands(Datasheets)
pdf icon
113990007(Datasheets)

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FAQs

Yes. You can also search 113990007 on website for other similar products.
We accept all major payment methods for all products including ET17977588. Please check your shopping cart at the time of order.
You can order Seeed Technology Co., Ltd brand products with 113990007 directly through our website or call us at +44 (0) 3303 800 157 or email our support team at sales@enrgtech.co.uk.
Yes. Our products in Evaluation Boards - Expansion Boards, Daughter Cards category are shipped in lowest possible time.
You will get a confirmation email regarding your order of Seeed Technology Co., Ltd 113990007. You can also check on our website or by contacting our customer support team for further order details on Seeed Technology Co., Ltd 113990007.
We use our internationally recognized delivery partners UPS/DHL. Collection of ET17977588 can also be arranged for the customer by international shipments through contacting our customer support team. Additionally, you can also search "Seeed Technology Co., Ltd" products on our website by using Enrgtech's Unique Manufacturing Part Number ET17977588.
Yes. We ship 113990007 Internationally to many countries around the world.
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