Xilinx Inc. XCZU3CG-L2SFVA625E

Xilinx Inc.

Product Information

HTSUS:
8542.39.0001
RoHS Status:
ROHS3 Compliant
Number of I/O:
180
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
625-BFBGA, FCBGA
RAM Size:
256KB
Peripherals:
DMA, WDT
Primary Attributes:
Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
REACH Status:
REACH Unaffected
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Package:
Tray
Moisture Sensitivity Level (MSL):
4 (72 Hours)
Architecture:
MCU, FPGA
Flash Size:
-
Series:
Zynq® UltraScale+™ MPSoC CG
Supplier Device Package:
625-FCBGA (21x21)
Core Processor:
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Speed:
533MHz, 1.3GHz
ECCN:
5A002A4 XIL
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This is manufactured by Xilinx Inc.. The manufacturer part number is XCZU3CG-L2SFVA625E. It is assigned with possible HTSUS value of 8542.39.0001. The product is rohs3 compliant. 180 is the I/O value of the product. The product has 0°c ~ 100°c (tj) operating temperature range. Moreover, the product comes in 625-bfbga, fcbga. The product has typical 256kb RAM size. It has supplied with other peripherals, such as dma, wdt. Primary Attributes of the Product: zynq®ultrascale+™ fpga, 154k+ logic cells. In addition, it is reach unaffected. It provides connectivity solutions through canbus, ebi/emi, ethernet, i²c, mmc/sd/sdio, spi, uart/usart, usb otg. It is shipped in tray package . Its typical moisture sensitivity level is 4 (72 hours). The product has been designed as mcu, fpga. The product zynq® ultrascale+™ mpsoc cg, is a highly preferred choice for users. 625-fcbga (21x21) is the supplier device package value. dual arm® cortex®-a53 mpcore™ with coresight™, dual arm®cortex™-r5 with coresight™ is the product's core processor. It has a robust speed of 533mhz, 1.3ghz. The product is designated with the 5a002a4 xil code number.

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Zynq UltraScale+ MPSoC Datasheet(Datasheets)
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Xiliinx RoHS3 Cert(Environmental Information)
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Xilinx REACH211 Cert(Environmental Information)

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