Manufacturer Standard Lead Time:
12 Weeks
Detailed Description:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 926K+ Logic Cells 533MHz, 600MHz, 1.3GHz 1760-FCBGA (42.5x42.5)
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes:
Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
Series:
Zynq® UltraScale+™ MPSoC EG
Customer Reference:
Number of I/O:
308
Supplier Device Package:
1760-FCBGA (42.5x42.5)
Packaging:
Tray
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature:
0°C ~ 100°C (TJ)
Architecture:
MCU, FPGA
Package / Case:
1760-BBGA, FCBGA
Peripherals:
DMA, WDT
RAM Size:
256KB
Speed:
533MHz, 600MHz, 1.3GHz
Manufacturer:
Xilinx Inc.