Microsemi Corporation M2S010T-1VFG400I

M2S010T-1VFG400I Microsemi Corporation
Microsemi Corporation

Product Information

Manufacturer Standard Lead Time:
10 Weeks
Manufacturer:
Microsemi Corporation
Detailed Description:
ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion®2 FPGA - 10K Logic Modules 166MHz 400-VFBGA (17x17)
Core Processor:
ARM® Cortex®-M3
Base Part Number:
M2S010T
Series:
SmartFusion®2
Primary Attributes:
FPGA - 10K Logic Modules
Number of I/O:
195
Supplier Device Package:
400-VFBGA (17x17)
Packaging:
Tray
Connectivity:
CANbus, Ethernet, I²C, SPI, UART/USART, USB
Operating Temperature:
-40°C ~ 100°C (TJ)
Architecture:
MCU, FPGA
Package / Case:
400-LFBGA
Peripherals:
DDR, PCIe, SERDES
RAM Size:
64KB
Speed:
166MHz
Flash Size:
256KB
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This is manufactured by Microsemi Corporation. The manufacturer part number is M2S010T-1VFG400I. It has typical 10 weeks of manufacturer standard lead time. The microsemi corporation's product offers user-desired applications. It features arm® cortex®-m3 system on chip (soc) ic smartfusion®2 fpga - 10k logic modules 166mhz 400-vfbga (17x17). arm® cortex®-m3 is the product's core processor. Base Part Number: m2s010t. The product smartfusion®2, is a highly preferred choice for users. Primary Attributes of the Product: fpga - 10k logic modules. 195 is the I/O value of the product. 400-vfbga (17x17) is the supplier device package value. In addition, tray is the available packaging type of the product. It provides connectivity solutions through canbus, ethernet, i²c, spi, uart/usart, usb. The product has -40°c ~ 100°c (tj) operating temperature range. The product has been designed as mcu, fpga. Moreover, the product comes in 400-lfbga. It has supplied with other peripherals, such as ddr, pcie, serdes. The product has typical 64kb RAM size. It has a robust speed of 166mhz. The product has 256kb flash size.

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SmartFusion2 Datasheet(Datasheets)
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SmartFusion2 Pin Descriptions(Datasheets)
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SF2/IGLOO2 Improvements 18/Jan/2017(PCN Design/Specification)
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Multiple Changes 17/Sep/2015(PCN Design/Specification)

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FAQs

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