Xilinx Inc. XCKU3P-1FFVA676I

Xilinx Inc.

Product Information

Manufacturer Standard Lead Time:
12 Weeks
Total RAM Bits:
31641600
Number of LABs/CLBs:
20340
Mounting Type:
Surface Mount
Number of Logic Elements/Cells:
355950
Series:
Kintex® UltraScale+™
Supplier Device Package:
676-FCBGA (27x27)
Packaging:
Tray
Operating Temperature:
-40°C ~ 100°C (TJ)
Voltage - Supply:
0.825V ~ 0.876V
Customer Reference:
Package / Case:
676-BBGA, FCBGA
Number of I/O:
256
Manufacturer:
Xilinx Inc.
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This is manufactured by Xilinx Inc.. The manufacturer part number is XCKU3P-1FFVA676I. It has typical 12 weeks of manufacturer standard lead time. It include a total of 31641600 RAM bits. It consists of 20340 CLBs/LABs. The product is available in surface mount configuration. The product contains 355950 logic cells/elements. The product kintex® ultrascale+™, is a highly preferred choice for users. 676-fcbga (27x27) is the supplier device package value. In addition, tray is the available packaging type of the product. The product has -40°c ~ 100°c (tj) operating temperature range. It has optimum voltage supply of 0.825v ~ 0.876v. Moreover, the product comes in 676-bbga, fcbga. 256 is the I/O value of the product. The xilinx inc.'s product offers user-desired applications.

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UltraScale™ Architecture Product Overview(Datasheets)
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Kintex UltraScale+ FPGAs Summary(Datasheets)
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Xilinx RoHS3(Environmental Information)

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