Xilinx Inc. XCKU11P-3FFVD900E

Enrgtech Part No: ET16259878
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Manufacturer Part No:
XCKU11P-3FFVD900E
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Manufacturer: Xilinx Inc.

Product Information

HTSUS:

8542.39.0001

RoHS Status:

ROHS3 Compliant

Number of I/O:

408

Operating Temperature:

0°C ~ 100°C (TJ)

Package / Case:

900-BBGA, FCBGA

Total RAM Bits:

53964800

Number of Logic Elements/Cells:

653100

Package:

Tray

standardLeadTime:

52 Weeks

Number of LABs/CLBs:

37320

Mounting Type:

Surface Mount

Series:

Kintex® UltraScale+™

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This is manufactured by Xilinx Inc.. The manufacturer part number is XCKU11P-3FFVD900E. It is assigned with possible HTSUS value of 8542.39.0001. The product is rohs3 compliant. 408 is the I/O value of the product. The product has 0°c ~ 100°c (tj) operating temperature range. Moreover, the product comes in 900-bbga, fcbga. It include a total of 53964800 RAM bits. The product contains 653100 logic cells/elements. It is shipped in tray package . It has a long 52 weeks standard lead time. It consists of 37320 CLBs/LABs. The product is available in surface mount configuration. The product kintex® ultrascale+™, is a highly preferred choice for users. 900-fcbga (31x31) is the supplier device package value. It has optimum voltage supply of 0.873v ~ 0.927v. Moreover, it corresponds to xcku11, a base product number of the product. The product is designated with the 3a991d code number.

UltraScale™ Architecture Product Overview(Datasheets)

Kintex UltraScale+ FPGAs Summary(Datasheets)

Xiliinx RoHS3 Cert(Environmental Information)

Xilinx REACH211 Cert(Environmental Information)

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Xilinx Inc. XCKU11P-3FFVD900E

XCKU11P-3FFVD900E

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