This is manufactured by Xilinx Inc.. The manufacturer part number is XC3S50AN-5FTG256C. It is assigned with possible HTSUS value of 8542.39.0001. 195 is the I/O value of the product. The product has 0°c ~ 85°c (tj) operating temperature range. Moreover, the product comes in 256-lbga. It include a total of 55296 RAM bits. The product contains 1584 logic cells/elements. In addition, it is reach unaffected. It is shipped in tray package . Its typical moisture sensitivity level is 3 (168 hours). It consists of 176 CLBs/LABs. The product is available in surface mount configuration. It contains 50000 gates. The product spartan®-3an, is a highly preferred choice for users. 256-ftbga (17x17) is the supplier device package value. It has optimum voltage supply of 1.14v ~ 1.26v. Moreover, it corresponds to xc3s50an, a base product number of the product. The product is designated with the ear99 code number.
Spartan-3AN FPGA User Guide(Datasheets)
Spartan-3AN FPGA Datasheet(Datasheets)
Spartan-3AN FPGA Series 02/Sep/2013(PCN Obsolescence/ EOL)
Xiliinx RoHS3 Cert(Environmental Information)
Xilinx REACH211 Cert(Environmental Information)
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This is manufactured by Xilinx Inc.. The manufacturer part number is XC3S50AN-5FTG256C. It is assigned with possible HTSUS value of 8542.39.0001. 195 is the I/O value of the product. The product has 0°c ~ 85°c (tj) operating temperature range. Moreover, the product comes in 256-lbga. It include a total of 55296 RAM bits. The product contains 1584 logic cells/elements. In addition, it is reach unaffected. It is shipped in tray package . Its typical moisture sensitivity level is 3 (168 hours). It consists of 176 CLBs/LABs. The product is available in surface mount configuration. It contains 50000 gates. The product spartan®-3an, is a highly preferred choice for users. 256-ftbga (17x17) is the supplier device package value. It has optimum voltage supply of 1.14v ~ 1.26v. Moreover, it corresponds to xc3s50an, a base product number of the product. The product is designated with the ear99 code number.
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