Texas Instruments TMS320C6746BZWT4

TMS320C6746BZWT4 Texas Instruments
Texas Instruments

Product Information

HTSUS:
8542.31.0001
RoHS Status:
ROHS3 Compliant
Clock Rate:
456MHz
Supplier Device Package:
361-NFBGA (16x16)
Operating Temperature:
0°C ~ 90°C (TJ)
Package / Case:
361-LFBGA
Voltage - Core:
1.00V, 1.10V, 1.20V, 1.30V
Type:
Fixed/Floating Point
REACH Status:
REACH Unaffected
Interface:
EBI/EMI, Ethernet MAC, Host Interface, I2C, McASP, McBSP, SPI, UART, USB
Manufacturer:
Texas Instruments
On-Chip RAM:
488kB
Moisture Sensitivity Level (MSL):
3 (168 Hours)
Mounting Type:
Surface Mount
Series:
TMS320C674x
Voltage - I/O:
1.8V, 3.3V
Packaging:
Tray
Non-Volatile Memory:
ROM (1.088MB)
Base Product Number:
TMS320
ECCN:
3A991A2
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This is manufactured by Texas Instruments. The manufacturer part number is TMS320C6746BZWT4. It is assigned with possible HTSUS value of 8542.31.0001. The product is rohs3 compliant. It has a clock rate of 456mhz. 361-nfbga (16x16) is the supplier device package value. The product has 0°c ~ 90°c (tj) operating temperature range. Moreover, the product comes in 361-lfbga. Its core voltage is [Voltage -Core]. It comes in fixed/floating point configuration. In addition, it is reach unaffected. A bespoke product is ebi/emi, ethernet mac, host interface, i2c, mcasp, mcbsp, spi, uart, usb interface. The texas instruments's product offers user-desired applications. The on-chip RAM includes 488kb. Its typical moisture sensitivity level is 3 (168 hours). The product is available in surface mount configuration. The product tms320c674x, is a highly preferred choice for users. It has a typical 1.8v, 3.3v I/O voltage. In addition, tray is the available packaging type of the product. It bears rom (1.088mb) of non-volatile memory. Moreover, it corresponds to tms320, a base product number of the product. The product is designated with the 3a991a2 code number.

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Freon/Netra/SubArtic EOL 06/Oct/2015(PCN Obsolescence/ EOL)
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Freon/Netra/SubArtic EOL Update 4/Nov/2015(PCN Obsolescence/ EOL)
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TMS320C6746BZWTD4(Datasheets)
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Hybrid Au/Cu Wire Bond Flow 08/Apr/2014(PCN Design/Specification)
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Multiple Changes Revision B 23/Jun/2014(PCN Design/Specification)

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