Texas Instruments TMS320DM8127SCYED0

TMS320DM8127SCYED0 Texas Instruments
Texas Instruments

Product Information

HTSUS:
8542.31.0001
RoHS Status:
ROHS3 Compliant
Clock Rate:
500MHz DSP, 600MHz ARM®
Supplier Device Package:
684-FCBGA (23x23)
Operating Temperature:
-40°C ~ 90°C (TJ)
Package / Case:
684-BFBGA, FCBGA
Voltage - Core:
1.15V
Type:
Digital Media System-on-Chip (DMSoC)
REACH Status:
REACH Unaffected
edacadModel:
TMS320DM8127SCYED0 Models
Interface:
CAN, Ethernet, I2C, McASP, McBSP, MMC/SD, SPI, UART, USB
On-Chip RAM:
832kB
Package:
Tray
Moisture Sensitivity Level (MSL):
4 (72 Hours)
edacadModelUrl:
/en/models/5764649
standardLeadTime:
12 Weeks
Mounting Type:
Surface Mount
Series:
DM81x Video SOC, DaVinci™
Voltage - I/O:
1.5V, 1.8V, 3.3V
Non-Volatile Memory:
ROM (48kB)
Base Product Number:
TMS320
ECCN:
5A992C
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This is manufactured by Texas Instruments. The manufacturer part number is TMS320DM8127SCYED0. It is assigned with possible HTSUS value of 8542.31.0001. The product is rohs3 compliant. It has a clock rate of 500mhz dsp, 600mhz arm®. 684-fcbga (23x23) is the supplier device package value. The product has -40°c ~ 90°c (tj) operating temperature range. Moreover, the product comes in 684-bfbga, fcbga. Its core voltage is [Voltage -Core]. It comes in digital media system-on-chip (dmsoc) configuration. In addition, it is reach unaffected. A bespoke product is can, ethernet, i2c, mcasp, mcbsp, mmc/sd, spi, uart, usb interface. The on-chip RAM includes 832kb. It is shipped in tray package . Its typical moisture sensitivity level is 4 (72 hours). It has a long 12 weeks standard lead time. The product is available in surface mount configuration. The product dm81x video soc, davinci™, is a highly preferred choice for users. It has a typical 1.5v, 1.8v, 3.3v I/O voltage. It bears rom (48kb) of non-volatile memory. Moreover, it corresponds to tms320, a base product number of the product. The product is designated with the 5a992c code number.

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Assembly Site 21/Oct/2022(PCN Assembly/Origin)
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TMS320DM8127BCYE0(Datasheets)
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BGA Devices 12/May/2017(PCN Packaging)
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Mult Devices Tray 12/Feb/2018(PCN Packaging)

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