NXP USA Inc. PMEG6010AESBC315

PMEG6010AESBC315 NXP USA Inc.
NXP USA Inc.

Product Information

HTSUS:
8541.10.0080
RoHS Status:
Not applicable
Package / Case:
2-XDFN
Operating Temperature - Junction:
150°C
REACH Status:
Vendor Undefined
Reverse Recovery Time (trr):
2.4 ns
Current - Average Rectified (Io):
1A
Speed:
Fast Recovery =< 500ns, > 200mA (Io)
Voltage - Forward (Vf) (Max) @ If:
625 mV @ 1 A
Voltage - DC Reverse (Vr) (Max):
60 V
Capacitance @ Vr, F:
20pF @ 10V, 1MHz
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Current - Reverse Leakage @ Vr:
650 µA @ 60 V
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
DSN1006-2
Packaging:
Bulk
Technology:
Schottky
Base Product Number:
PMEG6010
ECCN:
EAR99
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This is manufactured by NXP USA Inc.. The manufacturer part number is PMEG6010AESBC315. It is assigned with possible HTSUS value of 8541.10.0080. The product is not applicable. Moreover, the product comes in 2-xdfn. The product operate at temperatures ranging from 150°c. In addition, it is vendor undefined. It has a trr (reverse recovery time) of 2.4 ns. It features a 1a of average rectified current. It has a robust speed of fast recovery =< 500ns, > 200ma (io). The product has a maximum forward voltage of 625 mv @ 1 a. While it has maximum reverse voltage of 60 v. Moreover, the product has a 20pf @ 10v, 1mhz capacitance. Its typical moisture sensitivity level is 1 (unlimited). 650 µa @ 60 v is the reverse leakage value of a bespoke product. The product is available in surface mount configuration. dsn1006-2 is the supplier device package value. In addition, bulk is the available packaging type of the product. This product use schottky technology. Moreover, it corresponds to pmeg6010, a base product number of the product. The product is designated with the ear99 code number.

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PMEG6010AESB(Datasheets)

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