NXP USA Inc. PMEG3010ESB315

PMEG3010ESB315 NXP USA Inc.
NXP USA Inc.

Product Information

HTSUS:
8541.10.0080
RoHS Status:
Not applicable
Package / Case:
2-XDFN
Operating Temperature - Junction:
150°C
REACH Status:
Vendor Undefined
Reverse Recovery Time (trr):
3.2 ns
Current - Average Rectified (Io):
1A
Speed:
Fast Recovery =< 500ns, > 200mA (Io)
Voltage - Forward (Vf) (Max) @ If:
565 mV @ 1 A
Package:
Bulk
Voltage - DC Reverse (Vr) (Max):
30 V
Capacitance @ Vr, F:
32pF @ 10V, 1MHz
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Current - Reverse Leakage @ Vr:
45 µA @ 30 V
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
DSN1006-2
Technology:
Schottky
ECCN:
EAR99
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This is manufactured by NXP USA Inc.. The manufacturer part number is PMEG3010ESB315. It is assigned with possible HTSUS value of 8541.10.0080. The product is not applicable. Moreover, the product comes in 2-xdfn. The product operate at temperatures ranging from 150°c. In addition, it is vendor undefined. It has a trr (reverse recovery time) of 3.2 ns. It features a 1a of average rectified current. It has a robust speed of fast recovery =< 500ns, > 200ma (io). The product has a maximum forward voltage of 565 mv @ 1 a. It is shipped in bulk package . While it has maximum reverse voltage of 30 v. Moreover, the product has a 32pf @ 10v, 1mhz capacitance. Its typical moisture sensitivity level is 1 (unlimited). 45 µa @ 30 v is the reverse leakage value of a bespoke product. The product is available in surface mount configuration. dsn1006-2 is the supplier device package value. This product use schottky technology. The product is designated with the ear99 code number.

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PMEG3010ESB(Datasheets)

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