NXP Semiconductors PMEG2010BELD,315

PMEG2010BELD-315 NXP Semiconductors PMEG2010BELD,315
NXP Semiconductors

Product Information

Operating Temperature - Junction:
150°C (Max)
Package / Case:
SOD-882
REACH Status:
REACH Unaffected
Reverse Recovery Time (trr):
1.6 ns
Current - Average Rectified (Io):
1A
Speed:
Fast Recovery =< 500ns, > 200mA (Io)
Voltage - Forward (Vf) (Max) @ If:
490 mV @ 1 A
Package:
Bulk
Voltage - DC Reverse (Vr) (Max):
20 V
Capacitance @ Vr, F:
40pF @ 1V, 1MHz
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Current - Reverse Leakage @ Vr:
200 µA @ 20 V
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
DFN1006-2
Technology:
Schottky
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This is manufactured by NXP Semiconductors. The manufacturer part number is PMEG2010BELD,315. The product operate at temperatures ranging from 150°c (max). Moreover, the product comes in sod-882. In addition, it is reach unaffected. It has a trr (reverse recovery time) of 1.6 ns. It features a 1a of average rectified current. It has a robust speed of fast recovery =< 500ns, > 200ma (io). The product has a maximum forward voltage of 490 mv @ 1 a. It is shipped in bulk package . While it has maximum reverse voltage of 20 v. Moreover, the product has a 40pf @ 1v, 1mhz capacitance. Its typical moisture sensitivity level is 1 (unlimited). 200 µa @ 20 v is the reverse leakage value of a bespoke product. The product is available in surface mount configuration. dfn1006-2 is the supplier device package value. This product use schottky technology.

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