onsemi RHRG3060-F085

RHRG3060-F085 onsemi
onsemi

Product Information

Reverse Recovery Time (trr):
45 ns
HTSUS:
8541.10.0080
RoHS Status:
ROHS3 Compliant
Package / Case:
TO-247-2
Operating Temperature - Junction:
-55°C ~ 175°C
title:
RHRG3060-F085
REACH Status:
REACH Unaffected
edacadModel:
RHRG3060-F085 Models
edacadModelUrl:
/en/models/5044747
Current - Average Rectified (Io):
30A
Speed:
Fast Recovery =< 500ns, > 200mA (Io)
Voltage - Forward (Vf) (Max) @ If:
2.1 V @ 30 A
Voltage - DC Reverse (Vr) (Max):
600 V
Capacitance @ Vr, F:
-
Moisture Sensitivity Level (MSL):
Not Applicable
Qualification:
AEC-Q101
standardLeadTime:
11 Weeks
Current - Reverse Leakage @ Vr:
250 µA @ 600 V
Mounting Type:
Through Hole
Grade:
Automotive
Series:
-
Supplier Device Package:
TO-247-2
Packaging:
Tube
Technology:
Avalanche
Base Product Number:
RHRG3060
ECCN:
EAR99
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This is manufactured by onsemi. The manufacturer part number is RHRG3060-F085. It has a trr (reverse recovery time) of 45 ns. It is assigned with possible HTSUS value of 8541.10.0080. The product is rohs3 compliant. Moreover, the product comes in to-247-2. The product operate at temperatures ranging from -55°c ~ 175°c. In addition, it is reach unaffected. It features a 30a of average rectified current. It has a robust speed of fast recovery =< 500ns, > 200ma (io). The product has a maximum forward voltage of 2.1 v @ 30 a. While it has maximum reverse voltage of 600 v. Its typical moisture sensitivity level is not applicable. It has a long 11 weeks standard lead time. 250 µa @ 600 v is the reverse leakage value of a bespoke product. The product is available in through hole configuration. The product is automotive, a grade of class. to-247-2 is the supplier device package value. In addition, tube is the available packaging type of the product. This product use avalanche technology. Moreover, it corresponds to rhrg3060, a base product number of the product. The product is designated with the ear99 code number.

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onsemi RoHS(Environmental Information)
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onsemi REACH(Environmental Information)
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Wafer Fab Site 19/Oct/2023(PCN Assembly/Origin)
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Mult Dev Datasheet Chg 20/Dec/2019(PCN Design/Specification)
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Logo 17/Aug/2017(PCN Design/Specification)
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RHRG3060-F085(Datasheets)
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Packing quantity increase 25/Jun/2021(PCN Packaging)
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Mult Devices 24/Oct/2017(PCN Packaging)
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Mult Device Part Number Chg 30/May/2017(PCN Part Number)

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FAQs

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