Vishay General Semiconductor - Diodes Division VS-HFA08TB60S-M3

Vishay General Semiconductor - Diodes Division

Product Information

HTSUS:
8541.10.0080
RoHS Status:
ROHS3 Compliant
Package / Case:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Reverse Recovery Time (trr):
55 ns
Operating Temperature - Junction:
-55°C ~ 150°C
REACH Status:
REACH Unaffected
Current - Average Rectified (Io):
8A
Speed:
Fast Recovery =< 500ns, > 200mA (Io)
Voltage - Forward (Vf) (Max) @ If:
2.1 V @ 16 A
Package:
Tube
Voltage - DC Reverse (Vr) (Max):
600 V
Capacitance @ Vr, F:
-
Moisture Sensitivity Level (MSL):
1 (Unlimited)
standardLeadTime:
16 Weeks
Current - Reverse Leakage @ Vr:
5 µA @ 600 V
Mounting Type:
Surface Mount
Series:
HEXFRED®
Supplier Device Package:
TO-263AB (D2PAK)
Technology:
Standard
Base Product Number:
HFA08
ECCN:
EAR99
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This is manufactured by Vishay General Semiconductor - Diodes Division. The manufacturer part number is VS-HFA08TB60S-M3. It is assigned with possible HTSUS value of 8541.10.0080. The product is rohs3 compliant. Moreover, the product comes in to-263-3, d2pak (2 leads + tab), to-263ab. It has a trr (reverse recovery time) of 55 ns. The product operate at temperatures ranging from -55°c ~ 150°c. In addition, it is reach unaffected. It features a 8a of average rectified current. It has a robust speed of fast recovery =< 500ns, > 200ma (io). The product has a maximum forward voltage of 2.1 v @ 16 a. It is shipped in tube package . While it has maximum reverse voltage of 600 v. Its typical moisture sensitivity level is 1 (unlimited). It has a long 16 weeks standard lead time. 5 µa @ 600 v is the reverse leakage value of a bespoke product. The product is available in surface mount configuration. The product hexfred®, is a highly preferred choice for users. to-263ab (d2pak) is the supplier device package value. This product use standard technology. Moreover, it corresponds to hfa08, a base product number of the product. The product is designated with the ear99 code number.

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VS-HFA08TB60S-M3(Datasheets)
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Packaging Information(Datasheets)

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