Vishay General Semiconductor - Diodes Division VI30100SG-E3/4W

VI30100SG-E3-4W Vishay General Semiconductor - Diodes Division VI30100SG-E3/4W
Vishay General Semiconductor - Diodes Division

Product Information

HTSUS:
8541.10.0080
RoHS Status:
ROHS3 Compliant
Package / Case:
TO-262-3 Long Leads, I2PAK, TO-262AA
Operating Temperature - Junction:
-40°C ~ 150°C
title:
VI30100SG-E3/4W
REACH Status:
REACH Unaffected
Current - Average Rectified (Io):
30A
Speed:
Fast Recovery =< 500ns, > 200mA (Io)
Voltage - Forward (Vf) (Max) @ If:
1 V @ 30 A
Voltage - DC Reverse (Vr) (Max):
100 V
Capacitance @ Vr, F:
-
Moisture Sensitivity Level (MSL):
1 (Unlimited)
standardLeadTime:
10 Weeks
Current - Reverse Leakage @ Vr:
350 µA @ 100 V
Mounting Type:
Through Hole
Series:
TMBS®
Supplier Device Package:
TO-262AA
Packaging:
Tube
Technology:
Schottky
Base Product Number:
VI30100
ECCN:
EAR99
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This is manufactured by Vishay General Semiconductor - Diodes Division. The manufacturer part number is VI30100SG-E3/4W. It is assigned with possible HTSUS value of 8541.10.0080. The product is rohs3 compliant. Moreover, the product comes in to-262-3 long leads, i2pak, to-262aa. The product operate at temperatures ranging from -40°c ~ 150°c. In addition, it is reach unaffected. It features a 30a of average rectified current. It has a robust speed of fast recovery =< 500ns, > 200ma (io). The product has a maximum forward voltage of 1 v @ 30 a. While it has maximum reverse voltage of 100 v. Its typical moisture sensitivity level is 1 (unlimited). It has a long 10 weeks standard lead time. 350 µa @ 100 v is the reverse leakage value of a bespoke product. The product is available in through hole configuration. The product tmbs®, is a highly preferred choice for users. to-262aa is the supplier device package value. In addition, tube is the available packaging type of the product. This product use schottky technology. Moreover, it corresponds to vi30100, a base product number of the product. The product is designated with the ear99 code number.

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Mult Dev Wafer Conversion 19/Aug/2019(PCN Assembly/Origin)
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IRLZ44(Datasheets)
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V(x)30100SG(Datasheets)

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