Rohm Semiconductor RFN20TJ6SGC9

RFN20TJ6SGC9 Rohm Semiconductor
Rohm Semiconductor

Product Information

Manufacturer Standard Lead Time:
12 Weeks
Base Part Number:
RFN20
Detailed Description:
Diode Standard 600V 20A Through Hole TO-220ACFP
Reverse Recovery Time (trr):
140ns
Current - Reverse Leakage @ Vr:
10µA @ 600V
Operating Temperature - Junction:
150°C (Max)
Mounting Type:
Through Hole
Voltage - DC Reverse (Vr) (Max):
600V
Voltage - Forward (Vf) (Max) @ If:
1.55V @ 20A
Supplier Device Package:
TO-220ACFP
Packaging:
Tube
Customer Reference:
Current - Average Rectified (Io):
20A
Package / Case:
TO-220-2 Full Pack
Diode Type:
Standard
Speed:
Fast Recovery =< 500ns, > 200mA (Io)
Manufacturer:
Rohm Semiconductor
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This is manufactured by Rohm Semiconductor. The manufacturer part number is RFN20TJ6SGC9. It has typical 12 weeks of manufacturer standard lead time. Base Part Number: rfn20. It features diode standard 600v 20a through hole to-220acfp. It has a trr (reverse recovery time) of 140ns. 10µa @ 600v is the reverse leakage value of a bespoke product. The product operate at temperatures ranging from 150°c (max). The product is available in through hole configuration. While it has maximum reverse voltage of 600v. The product has a maximum forward voltage of 1.55v @ 20a. to-220acfp is the supplier device package value. In addition, tube is the available packaging type of the product. It features a 20a of average rectified current. Moreover, the product comes in to-220-2 full pack. It is designed with a standard diode. It has a robust speed of fast recovery =< 500ns, > 200ma (io). The rohm semiconductor's product offers user-desired applications.

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RFN20TJ6SGC9 ESD Data(Environmental Information)
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Diode Whisker Info(Environmental Information)
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TO220ACFP-HF Constitution Material List(Environmental Information)
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TO220ACFP C9 Taping Spec(Datasheets)
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RFN20TJ6S(Datasheets)
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FRD-THD Reliability Test(Other Related Documents)
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TO-220ACFP Part Marking(Other Related Documents)
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Diode Flammability(Other Related Documents)
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TO220ACFP Inner Structure(Other Related Documents)

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FAQs

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