Vishay General Semiconductor - Diodes Division FEPB16DT-E3/45

Vishay General Semiconductor - Diodes Division

Product Information

HTSUS:
8541.10.0080
RoHS Status:
ROHS3 Compliant
Package / Case:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Diode Configuration:
1 Pair Common Cathode
Operating Temperature - Junction:
-55°C ~ 150°C
REACH Status:
REACH Unaffected
Reverse Recovery Time (trr):
35 ns
Speed:
Fast Recovery =< 500ns, > 200mA (Io)
Voltage - Forward (Vf) (Max) @ If:
950 mV @ 8 A
Package:
Tube
Voltage - DC Reverse (Vr) (Max):
200 V
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Current - Average Rectified (Io) (per Diode):
8A
Current - Reverse Leakage @ Vr:
10 µA @ 200 V
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
TO-263AB (D2PAK)
Technology:
Standard
Base Product Number:
FEPB16
ECCN:
EAR99
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This is manufactured by Vishay General Semiconductor - Diodes Division. The manufacturer part number is FEPB16DT-E3/45. It is assigned with possible HTSUS value of 8541.10.0080. The product is rohs3 compliant. Moreover, the product comes in to-263-3, d2pak (2 leads + tab), to-263ab. The diode features a 1 pair common cathode configuration. The product operate at temperatures ranging from -55°c ~ 150°c. In addition, it is reach unaffected. It has a trr (reverse recovery time) of 35 ns. It has a robust speed of fast recovery =< 500ns, > 200ma (io). The product has a maximum forward voltage of 950 mv @ 8 a. It is shipped in tube package . While it has maximum reverse voltage of 200 v. Its typical moisture sensitivity level is 1 (unlimited). The average rectified current at per diode is 8a. 10 µa @ 200 v is the reverse leakage value of a bespoke product. The product is available in surface mount configuration. to-263ab (d2pak) is the supplier device package value. This product use standard technology. Moreover, it corresponds to fepb16, a base product number of the product. The product is designated with the ear99 code number.

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Mult Dev Assembly Chg 31/Aug/2018(PCN Assembly/Origin)
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FEP(F,B)16AT - 16JT(Datasheets)
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Packaging Information(Datasheets)
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Mult Dev DPAK EOL 31/Oct/2023(PCN Obsolescence/ EOL)

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