Vishay General Semiconductor - Diodes Division MBRB25H60CTHE3/81

Vishay General Semiconductor - Diodes Division

Product Information

HTSUS:
8541.10.0080
RoHS Status:
ROHS3 Compliant
Package / Case:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Diode Configuration:
1 Pair Common Cathode
Operating Temperature - Junction:
-65°C ~ 175°C
REACH Status:
REACH Unaffected
Speed:
Fast Recovery =< 500ns, > 200mA (Io)
Voltage - Forward (Vf) (Max) @ If:
700 mV @ 15 A
Package:
Tape & Reel (TR)
Voltage - DC Reverse (Vr) (Max):
60 V
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Qualification:
AEC-Q101
Current - Average Rectified (Io) (per Diode):
15A
Current - Reverse Leakage @ Vr:
100 µA @ 60 V
Mounting Type:
Surface Mount
Grade:
Automotive
Series:
-
Supplier Device Package:
TO-263AB (D2PAK)
Technology:
Schottky
Base Product Number:
MBRB25
ECCN:
EAR99
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This is manufactured by Vishay General Semiconductor - Diodes Division. The manufacturer part number is MBRB25H60CTHE3/81. It is assigned with possible HTSUS value of 8541.10.0080. The product is rohs3 compliant. Moreover, the product comes in to-263-3, d2pak (2 leads + tab), to-263ab. The diode features a 1 pair common cathode configuration. The product operate at temperatures ranging from -65°c ~ 175°c. In addition, it is reach unaffected. It has a robust speed of fast recovery =< 500ns, > 200ma (io). The product has a maximum forward voltage of 700 mv @ 15 a. It is shipped in tape & reel (tr) package . While it has maximum reverse voltage of 60 v. Its typical moisture sensitivity level is 1 (unlimited). The average rectified current at per diode is 15a. 100 µa @ 60 v is the reverse leakage value of a bespoke product. The product is available in surface mount configuration. The product is automotive, a grade of class. to-263ab (d2pak) is the supplier device package value. This product use schottky technology. Moreover, it corresponds to mbrb25, a base product number of the product. The product is designated with the ear99 code number.

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MBR(F,B)25HxxCT(Datasheets)
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Packaging Information(Datasheets)
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Material/Wafer/Process Chg 20/Oct/2016(PCN Part Status Change)

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