Microchip Technology MSC2X50SDA170J

MSC2X50SDA170J Microchip Technology
Microchip Technology

Product Information

HTSUS:
8541.10.0080
Package / Case:
SOT-227-4, miniBLOC
Diode Configuration:
2 Independent
Operating Temperature - Junction:
-55°C ~ 175°C
REACH Status:
REACH Unaffected
Reverse Recovery Time (trr):
0 ns
Speed:
No Recovery Time > 500mA (Io)
Manufacturer:
Microchip Technology
Voltage - Forward (Vf) (Max) @ If:
1.8 V @ 50 A
Voltage - DC Reverse (Vr) (Max):
1700 V
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Current - Average Rectified (Io) (per Diode):
50A
standardLeadTime:
10 Weeks
Current - Reverse Leakage @ Vr:
200 µA @ 1700 V
Mounting Type:
Chassis Mount
Series:
-
Supplier Device Package:
SOT-227 (ISOTOP®)
Packaging:
Tube
Technology:
SiC (Silicon Carbide) Schottky
Base Product Number:
MSC2X50
ECCN:
EAR99
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This is manufactured by Microchip Technology. The manufacturer part number is MSC2X50SDA170J. It is assigned with possible HTSUS value of 8541.10.0080. Moreover, the product comes in sot-227-4, minibloc. The diode features a 2 independent configuration. The product operate at temperatures ranging from -55°c ~ 175°c. In addition, it is reach unaffected. It has a trr (reverse recovery time) of 0 ns. It has a robust speed of no recovery time > 500ma (io). The microchip technology's product offers user-desired applications. The product has a maximum forward voltage of 1.8 v @ 50 a. While it has maximum reverse voltage of 1700 v. Its typical moisture sensitivity level is 1 (unlimited). The average rectified current at per diode is 50a. It has a long 10 weeks standard lead time. 200 µa @ 1700 v is the reverse leakage value of a bespoke product. The product is available in chassis mount configuration. sot-227 (isotop®) is the supplier device package value. In addition, tube is the available packaging type of the product. This product use sic (silicon carbide) schottky technology. Moreover, it corresponds to msc2x50, a base product number of the product. The product is designated with the ear99 code number.

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MG15F-35AB/MG15F-0140B Mold Compound 26/Feb/2024(PCN Assembly/Origin)
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Microchip CA Prop65(Environmental Information)
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Microchip RoHS(Environmental Information)
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Microchip REACH(Environmental Information)
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Top Marking Changes 22/Feb/2023(PCN Design/Specification)
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Label Change 03/Jan/2023(PCN Packaging)

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