STMicroelectronics STPS30170CW

STPS30170CW STMicroelectronics
STMicroelectronics

Product Information

HTSUS:
8541.10.0080
RoHS Status:
ROHS3 Compliant
Package / Case:
TO-247-3
Diode Configuration:
1 Pair Common Cathode
Operating Temperature - Junction:
175°C (Max)
title:
STPS30170CW
REACH Status:
REACH Unaffected
edacadModel:
STPS30170CW Models
edacadModelUrl:
/en/models/954127
Speed:
Fast Recovery =< 500ns, > 200mA (Io)
Manufacturer:
STMicroelectronics
Voltage - Forward (Vf) (Max) @ If:
920 mV @ 15 A
Voltage - DC Reverse (Vr) (Max):
170 V
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Current - Average Rectified (Io) (per Diode):
15A
standardLeadTime:
45 Weeks
Current - Reverse Leakage @ Vr:
20 µA @ 170 V
Mounting Type:
Through Hole
Series:
-
Supplier Device Package:
TO-247-3
Packaging:
Tube
Technology:
Schottky
Base Product Number:
STPS30170
ECCN:
EAR99
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This is manufactured by STMicroelectronics. The manufacturer part number is STPS30170CW. It is assigned with possible HTSUS value of 8541.10.0080. The product is rohs3 compliant. Moreover, the product comes in to-247-3. The diode features a 1 pair common cathode configuration. The product operate at temperatures ranging from 175°c (max). In addition, it is reach unaffected. It has a robust speed of fast recovery =< 500ns, > 200ma (io). The stmicroelectronics's product offers user-desired applications. The product has a maximum forward voltage of 920 mv @ 15 a. While it has maximum reverse voltage of 170 v. Its typical moisture sensitivity level is 1 (unlimited). The average rectified current at per diode is 15a. It has a long 45 weeks standard lead time. 20 µa @ 170 v is the reverse leakage value of a bespoke product. The product is available in through hole configuration. to-247-3 is the supplier device package value. In addition, tube is the available packaging type of the product. This product use schottky technology. Moreover, it corresponds to stps30170, a base product number of the product. The product is designated with the ear99 code number.

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IPG/14/8475 16/May/2014(PCN Assembly/Origin)
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Mult Dev Mold Compound Chg 6/May/2019(PCN Design/Specification)
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STPS30170C(Datasheets)
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Standard outer labelling 15/Nov/2023(PCN Packaging)

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