Vishay Semiconductor Diodes Division VS-HFA140FA60

VS-HFA140FA60 Vishay Semiconductor Diodes Division
Vishay Semiconductor Diodes Division

Product Information

Manufacturer Standard Lead Time:
28 Weeks
Base Part Number:
HFA140
Detailed Description:
Diode Array 2 Independent Standard 600V 70A (DC) Chassis Mount SOT-227-4, miniBLOC
Reverse Recovery Time (trr):
90ns
Current - Reverse Leakage @ Vr:
20µA @ 600V
Operating Temperature - Junction:
-55°C ~ 150°C
Mounting Type:
Chassis Mount
Series:
HEXFRED®
Voltage - Forward (Vf) (Max) @ If:
1.7V @ 60A
Supplier Device Package:
SOT-227
Packaging:
Tray
Current - Average Rectified (Io) (per Diode):
70A (DC)
Diode Configuration:
2 Independent
Package / Case:
SOT-227-4, miniBLOC
Voltage - DC Reverse (Vr) (Max):
600V
Diode Type:
Standard
Speed:
Fast Recovery =< 500ns, > 200mA (Io)
Manufacturer:
Vishay Semiconductor Diodes Division
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This is manufactured by Vishay Semiconductor Diodes Division. The manufacturer part number is VS-HFA140FA60. It has typical 28 weeks of manufacturer standard lead time. Base Part Number: hfa140. It features diode array 2 independent standard 600v 70a (dc) chassis mount sot-227-4, minibloc. It has a trr (reverse recovery time) of 90ns. 20µa @ 600v is the reverse leakage value of a bespoke product. The product operate at temperatures ranging from -55°c ~ 150°c. The product is available in chassis mount configuration. The product hexfred®, is a highly preferred choice for users. The product has a maximum forward voltage of 1.7v @ 60a. sot-227 is the supplier device package value. In addition, tray is the available packaging type of the product. The average rectified current at per diode is 70a (dc). The diode features a 2 independent configuration. Moreover, the product comes in sot-227-4, minibloc. While it has maximum reverse voltage of 600v. It is designed with a standard diode. It has a robust speed of fast recovery =< 500ns, > 200ma (io). The vishay semiconductor diodes division's product offers user-desired applications.

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VS-HFA140FA60(Datasheets)
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Ink to Laser 03/Feb/2016(PCN Design/Specification)

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FAQs

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