Rohm Semiconductor BAT54AHYFHT116

BAT54AHYFHT116 Rohm Semiconductor
Rohm Semiconductor

Product Information

HTSUS:
8541.10.0070
RoHS Status:
ROHS3 Compliant
Package / Case:
TO-236-3, SC-59, SOT-23-3
Diode Configuration:
1 Pair Common Anode
Reverse Recovery Time (trr):
50 ns
Operating Temperature - Junction:
150°C (Max)
REACH Status:
REACH Unaffected
Speed:
Small Signal =< 200mA (Io), Any Speed
Voltage - Forward (Vf) (Max) @ If:
800 mV @ 100 mA
Package:
Tape & Reel (TR)
Voltage - DC Reverse (Vr) (Max):
30 V
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Qualification:
AEC-Q101
Current - Average Rectified (Io) (per Diode):
200mA (DC)
standardLeadTime:
12 Weeks
Current - Reverse Leakage @ Vr:
2 µA @ 25 V
Mounting Type:
Surface Mount
Grade:
Automotive
Series:
-
Supplier Device Package:
SSD3
Technology:
Schottky
Base Product Number:
BAT54
ECCN:
EAR99
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This is manufactured by Rohm Semiconductor. The manufacturer part number is BAT54AHYFHT116. It is assigned with possible HTSUS value of 8541.10.0070. The product is rohs3 compliant. Moreover, the product comes in to-236-3, sc-59, sot-23-3. The diode features a 1 pair common anode configuration. It has a trr (reverse recovery time) of 50 ns. The product operate at temperatures ranging from 150°c (max). In addition, it is reach unaffected. It has a robust speed of small signal =< 200ma (io), any speed. The product has a maximum forward voltage of 800 mv @ 100 ma. It is shipped in tape & reel (tr) package . While it has maximum reverse voltage of 30 v. Its typical moisture sensitivity level is 1 (unlimited). The average rectified current at per diode is 200ma (dc). It has a long 12 weeks standard lead time. 2 µa @ 25 v is the reverse leakage value of a bespoke product. The product is available in surface mount configuration. The product is automotive, a grade of class. ssd3 is the supplier device package value. This product use schottky technology. Moreover, it corresponds to bat54, a base product number of the product. The product is designated with the ear99 code number.

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