Microchip Technology MCP4551T-103E/MS

MCP4551T-103E-MS Microchip Technology MCP4551T-103E/MS
Microchip Technology

Product Information

Manufacturer Standard Lead Time:
8 Weeks
Detailed Description:
Digital Potentiometer 10k Ohm 1 Circuit 257 Taps I²C Interface 8-MSOP
Operating Temperature:
-40°C ~ 125°C
Package / Case:
8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Tolerance:
±20%
Packaging:
Cut Tape (CT)
Resistance (Ohms):
10k
Number of Taps:
257
Base Part Number:
MCP4551
Resistance - Wiper (Ohms) (Typ):
75
Interface:
I²C
Configuration:
Potentiometer
Manufacturer:
Microchip Technology
Taper:
Linear
Number of Circuits:
1
Features:
Mute, Selectable Address
Mounting Type:
Surface Mount
Supplier Device Package:
8-MSOP
Memory Type:
Volatile
Voltage - Supply:
1.8V ~ 5.5V
Customer Reference:
Temperature Coefficient (Typ):
150ppm/°C
Checking for live stock

This is manufactured by Microchip Technology. The manufacturer part number is MCP4551T-103E/MS. It has typical 8 weeks of manufacturer standard lead time. It features digital potentiometer 10k ohm 1 circuit 257 taps i²c interface 8-msop. The product has -40°c ~ 125°c operating temperature range. Moreover, the product comes in 8-tssop, 8-msop (0.118", 3.00mm width). It features ±20% of tolerance value. In addition, cut tape (ct) is the available packaging type of the product. Moreover, the given resistance of the product is 10k. It contains 257 taps. Base Part Number: mcp4551. The product features a typical resistance of 75. A bespoke product is i²c interface. The product is available in potentiometer configuration. The microchip technology's product offers user-desired applications. It features a linear taper. It integrates 1 circuits. The splendid features of the product include mute, selectable address. The product is available in surface mount configuration. 8-msop is the supplier device package value. It is a type of volatile memory type. It has optimum voltage supply of 1.8v ~ 5.5v. The typical temperature coefficient of 150ppm/°c.

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Mult Devices 28/Nov/2017(PCN Assembly/Origin)
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Bond Wire Qualification 08/Jun/2016(PCN Design/Specification)
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Packing Changes 10/Oct/2016(PCN Packaging)

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