Intel EPM2210GF256C3

EPM2210GF256C3 Intel
Intel

Product Information

Number of Logic Elements/Blocks:
2210
HTSUS:
8542.39.0001
RoHS Status:
RoHS non-compliant
Package / Case:
256-BGA
Number of I/O:
204
Operating Temperature:
0°C ~ 85°C (TJ)
Moisture Sensitivity Level (MSL):
3 (168 Hours)
DigiKey Programmable:
Not Verified
Delay Time tpd(1) Max:
7 ns
REACH Status:
REACH Unaffected
edacadModel:
EPM2210GF256C3 Models
Programmable Type:
In System Programmable
edacadModelUrl:
/en/models/739841
Manufacturer:
Intel
Voltage Supply - Internal:
1.71V ~ 1.89V
Number of Macrocells:
1700
Mounting Type:
Surface Mount
Series:
MAX® II
Supplier Device Package:
256-FBGA (17x17)
Packaging:
Tray
Base Product Number:
EPM2210
ECCN:
3A001A7A
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This is manufactured by Intel. The manufacturer part number is EPM2210GF256C3. It has [Number of Logic Elements/Block] logic elements or blocks. It is assigned with possible HTSUS value of 8542.39.0001. The product is rohs non-compliant. Moreover, the product comes in 256-bga. 204 is the I/O value of the product. The product has 0°c ~ 85°c (tj) operating temperature range. Its typical moisture sensitivity level is 3 (168 hours). It has a maximum delay time of 7 ns. In addition, it is reach unaffected. It is in system programmable. The intel's product offers user-desired applications. Internal voltage supply volts include 1.71v ~ 1.89v. Consists of 1700 macrocells. The product is available in surface mount configuration. The product max® ii, is a highly preferred choice for users. 256-fbga (17x17) is the supplier device package value. In addition, tray is the available packaging type of the product. Moreover, it corresponds to epm2210, a base product number of the product. The product is designated with the 3a001a7a code number.

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Mult PN LABEL 01/08/2023(PCN Design/Specification)
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Quartus SW/Web Chgs 23/Sep/2021(PCN Design/Specification)
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MAX II EOL-Reversal 19/Mar/2021(PCN Obsolescence/ EOL)
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Mult Dev EOL 4/Dec/2020(PCN Obsolescence/ EOL)
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Max II Device Order Guide(Datasheets)
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Mult Dev Label Chgs 24/Feb/2020(PCN Packaging)
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Mult Dev Label Chgs 15/Apr/2024(PCN Packaging)
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MAX II Device Family Errata(Errata)

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