Texas Instruments LM193DRG4

LM193DRG4 Texas Instruments
Texas Instruments

Product Information

HTSUS:
8542.39.0001
RoHS Status:
ROHS3 Compliant
Current - Input Bias (Max):
0.25µA @ 5V
Current - Quiescent (Max):
2.5mA
Operating Temperature:
-55°C ~ 125°C
Voltage - Supply, Single/Dual (±):
2V ~ 36V, ±1V ~ 18V
Package / Case:
8-SOIC (0.154", 3.90mm Width)
Type:
General Purpose
Propagation Delay (Max):
-
REACH Status:
REACH Unaffected
Output Type:
Open-Collector, Rail-to-Rail
Hysteresis:
-
edacadModel:
LM193DRG4 Models
edacadModelUrl:
/en/models/1898731
CMRR, PSRR (Typ):
-
Manufacturer:
Texas Instruments
Voltage - Input Offset (Max):
5mV @ 30V
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Current - Output (Typ):
20mA
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
8-SOIC
Packaging:
Tape & Reel (TR)
Number of Elements:
2
Base Product Number:
LM193
ECCN:
EAR99
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This is manufactured by Texas Instruments. The manufacturer part number is LM193DRG4. It is assigned with possible HTSUS value of 8542.39.0001. The product is rohs3 compliant. The maximum input bias current includes 0.25µa @ 5v. It has a maximum quiescent current of 2.5ma. The product has -55°c ~ 125°c operating temperature range. It features a typical 2v ~ 36v, ±1v ~ 18v voltage of single or dual. Moreover, the product comes in 8-soic (0.154", 3.90mm width). It comes in general purpose configuration. In addition, it is reach unaffected. Furthermore, it has aopen-collector, rail-to-rail output. The texas instruments's product offers user-desired applications. The maximum input offset voltage of 5mv @ 30v. Its typical moisture sensitivity level is 1 (unlimited). Features a typical output current of 20ma. The product is available in surface mount configuration. 8-soic is the supplier device package value. In addition, tape & reel (tr) is the available packaging type of the product. It carries 2 elements. Moreover, it corresponds to lm193, a base product number of the product. The product is designated with the ear99 code number.

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Mult Dev 30/Oct/2019(PCN Assembly/Origin)
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Mult Dev Assembly/Wafer Fab/Design 28/Mar/2024(PCN Design/Specification)

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