Renesas Electronics Corporation 83026AMILF

83026AMILF Renesas Electronics Corporation
Renesas Electronics Corporation

Product Information

HTSUS:
8542.39.0001
RoHS Status:
ROHS3 Compliant
Operating Temperature:
-40°C ~ 85°C
Package / Case:
8-SOIC (0.154", 3.90mm Width)
Input:
HCSL, LVDS, LVHSTL, LVPECL, SSTL
Type:
Fanout Buffer (Distribution)
Ratio - Input:Output:
1:2
REACH Status:
REACH Unaffected
Differential - Input:Output:
Yes/No
Frequency - Max:
350 MHz
Manufacturer:
Renesas Electronics Corporation
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Output:
LVCMOS, LVTTL
Number of Circuits:
1
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
8-SOIC
Packaging:
Tube
Voltage - Supply:
3V ~ 3.6V
Base Product Number:
83026A
ECCN:
EAR99
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This is manufactured by Renesas Electronics Corporation. The manufacturer part number is 83026AMILF. It is assigned with possible HTSUS value of 8542.39.0001. The product is rohs3 compliant. The product has -40°c ~ 85°c operating temperature range. Moreover, the product comes in 8-soic (0.154", 3.90mm width). Its input values include hcsl, lvds, lvhstl, lvpecl, sstl. It comes in fanout buffer (distribution) configuration. The ratio between its input and output is 1:2. In addition, it is reach unaffected. The differential input and output values included: yes/no. It maximum frequency is 350 mhz. The renesas electronics corporation's product offers user-desired applications. Its typical moisture sensitivity level is 1 (unlimited). Moreover, the product allow the output of lvcmos, lvttl. It integrates 1 circuits. The product is available in surface mount configuration. 8-soic is the supplier device package value. In addition, tube is the available packaging type of the product. It has optimum voltage supply of 3v ~ 3.6v. Moreover, it corresponds to 83026a, a base product number of the product. The product is designated with the ear99 code number.

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Mult Dev EOL 1/Mar/2019(PCN Obsolescence/ EOL)
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Alternate Assembly Facility 14/Apr/2016(PCN Assembly/Origin)
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Au/CuPd Bond Wire Chg 14/Oct/2015(PCN Design/Specification)
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All Dev Label Chg 1/Dec/2022(PCN Packaging)

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FAQs

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