Texas Instruments LM48822TLX/NOPB

LM48822TLX-NOPB Texas Instruments LM48822TLX/NOPB
Texas Instruments

Product Information

HTSUS:
8542.33.0001
RoHS Status:
ROHS3 Compliant
Operating Temperature:
-40°C ~ 85°C (TA)
Max Output Power x Channels @ Load:
40mW x 2 @ 32Ohm
Package / Case:
16-WFBGA, DSBGA
Type:
Class AB
title:
LM48822TLX/NOPB
REACH Status:
REACH Unaffected
Output Type:
Headphones, 2-Channel (Stereo)
edacadModel:
LM48822TLX/NOPB Models
edacadModelUrl:
/en/models/1871695
Manufacturer:
Texas Instruments
Moisture Sensitivity Level (MSL):
1 (Unlimited)
standardLeadTime:
18 Weeks
Features:
Depop, Differential Inputs, I2C, Mute, Shutdown, Volume Control
Mounting Type:
Surface Mount
Series:
Boomer®
Supplier Device Package:
16-DSBGA
Packaging:
Tape & Reel (TR)
Voltage - Supply:
2.4V ~ 5.5V
Base Product Number:
LM48822
ECCN:
EAR99
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This is manufactured by Texas Instruments. The manufacturer part number is LM48822TLX/NOPB. It is assigned with possible HTSUS value of 8542.33.0001. The product is rohs3 compliant. The product has -40°c ~ 85°c (ta) operating temperature range. It has a maximum output power into channels at given loads, such as 40mw x 2 @ 32ohm. Moreover, the product comes in 16-wfbga, dsbga. It comes in class ab configuration. In addition, it is reach unaffected. Furthermore, it has aheadphones, 2-channel (stereo) output. The texas instruments's product offers user-desired applications. Its typical moisture sensitivity level is 1 (unlimited). It has a long 18 weeks standard lead time. The splendid features of the product include depop, differential inputs, i2c, mute, shutdown, volume control. The product is available in surface mount configuration. The product boomer®, is a highly preferred choice for users. 16-dsbga is the supplier device package value. In addition, tape & reel (tr) is the available packaging type of the product. It has optimum voltage supply of 2.4v ~ 5.5v. Moreover, it corresponds to lm48822, a base product number of the product. The product is designated with the ear99 code number.

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Wafer Process Revision A 14/Jul/2014(PCN Assembly/Origin)

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