NXP USA Inc. NX3L1T3157GM,132

NX3L1T3157GM-132 NXP USA Inc. NX3L1T3157GM,132
NXP USA Inc.

Product Information

Detailed Description:
1 Circuit IC Switch 2:1 500mOhm 6-XSON, SOT886 (1.45x1)
Current - Leakage (IS(off)) (Max):
10nA
-3db Bandwidth:
60MHz
Channel Capacitance (CS(off), CD(off)):
35pF
On-State Resistance (Max):
500mOhm
Supplier Device Package:
6-XSON, SOT886 (1.45x1)
Charge Injection:
15pC
Packaging:
Cut Tape (CT)
Operating Temperature:
-40°C ~ 125°C (TA)
Voltage - Supply, Single (V+):
1.4V ~ 4.3V
Multiplexer/Demultiplexer Circuit:
2:1
Package / Case:
6-XFDFN
Switch Time (Ton, Toff) (Max):
40ns, 20ns
Channel-to-Channel Matching (ΔRon):
20mOhm
Switch Circuit:
SPDT
Number of Circuits:
1
Manufacturer:
NXP USA Inc.
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This is manufactured by NXP USA Inc.. The manufacturer part number is NX3L1T3157GM,132. It features 1 circuit ic switch 2:1 500mohm 6-xson, sot886 (1.45x1). The maximum current leakage of the product included 10na. A 60mhz of bandwidth. Features 35pf channel capacitance. It has a maximum on-state resistance of 500mohm. 6-xson, sot886 (1.45x1) is the supplier device package value. It has 15pc charge injection parameters. In addition, cut tape (ct) is the available packaging type of the product. The product has -40°c ~ 125°c (ta) operating temperature range. Single voltage supply of 1.4v ~ 4.3v. Ratio of multiplexer/demultiplexer circuit 2:1. Moreover, the product comes in 6-xfdfn. Has a 40ns, 20ns maximum switch time. Features 20mohm of channel-to-channel matching. Features switch circuit of spdt. It integrates 1 circuits. The nxp usa inc.'s product offers user-desired applications.

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Mult Devices EOL 30/May/2019(PCN Obsolescence/ EOL)
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NX3L1T3157(Datasheets)

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