Texas Instruments LM77CIMX-5/NOPB

LM77CIMX-5-NOPB Texas Instruments LM77CIMX-5/NOPB
Texas Instruments

Product Information

HTSUS:
8542.39.0001
RoHS Status:
ROHS3 Compliant
Sensing Temperature - Remote:
-
Operating Temperature:
-55°C ~ 125°C
Package / Case:
8-SOIC (0.154", 3.90mm Width)
Accuracy - Highest (Lowest):
±1.5°C (±3°C)
Sensor Type:
Digital, Local
REACH Status:
REACH Unaffected
Output Type:
I2C
edacadModel:
LM77CIMX-5/NOPB Models
edacadModelUrl:
/en/models/367334
Test Condition:
-10°C ~ 65°C (-55°C ~ 125°C)
Package:
Tape & Reel (TR)
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Sensing Temperature - Local:
-55°C ~ 125°C
standardLeadTime:
6 Weeks
Resolution:
9 b
Features:
Output Switch, Programmable Limit, Shutdown Mode
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
8-SOIC
Voltage - Supply:
3V ~ 5.5V
Base Product Number:
LM77
ECCN:
EAR99
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This is manufactured by Texas Instruments. The manufacturer part number is LM77CIMX-5/NOPB. It is assigned with possible HTSUS value of 8542.39.0001. The product is rohs3 compliant. The product has -55°c ~ 125°c operating temperature range. Moreover, the product comes in 8-soic (0.154", 3.90mm width). While the highest and lowest accuracy level includes ±1.5°c (±3°c). These sensors are sort of digital, local. In addition, it is reach unaffected. Furthermore, it has ai2c output. Test condition included -10°c ~ 65°c (-55°c ~ 125°c). It is shipped in tape & reel (tr) package . Its typical moisture sensitivity level is 1 (unlimited). The local sensing temperature of the product is -55°c ~ 125°c. It has a long 6 weeks standard lead time. Features 9 b resolution. The splendid features of the product include output switch, programmable limit, shutdown mode. The product is available in surface mount configuration. 8-soic is the supplier device package value. It has optimum voltage supply of 3v ~ 5.5v. Moreover, it corresponds to lm77, a base product number of the product. The product is designated with the ear99 code number.

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Assembly Process 05/May/2021(PCN Assembly/Origin)
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SOIC Pkg Wire Bonding Update 24/Jul/2013(PCN Design/Specification)
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SOIC Pkg Wire Bonding 20/Mar/2013(PCN Design/Specification)

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