Texas Instruments LM75BIMX-5

LM75BIMX-5 Texas Instruments
Texas Instruments

Product Information

HTSUS:
8542.39.0060
RoHS Status:
RoHS non-compliant
Sensing Temperature - Remote:
-
Operating Temperature:
-55°C ~ 125°C
Package / Case:
8-SOIC (0.154", 3.90mm Width)
Sensor Type:
Digital, Local
title:
LM75BIMX-5
REACH Status:
REACH Affected
Output Type:
I2C
edacadModel:
LM75BIMX-5 Models
edacadModelUrl:
/en/models/3697412
Test Condition:
-25°C ~ 100°C (-55°C ~ 125°C)
Manufacturer:
Texas Instruments
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Sensing Temperature - Local:
-55°C ~ 125°C
Accuracy - Highest (Lowest):
±2°C (±3°C)
Resolution:
9 b
Features:
Output Switch, Programmable Limit, Shutdown Mode
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
8-SOIC
Packaging:
Tape & Reel (TR)
Voltage - Supply:
3V ~ 5.5V
Base Product Number:
LM75
ECCN:
EAR99
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This is manufactured by Texas Instruments. The manufacturer part number is LM75BIMX-5. It is assigned with possible HTSUS value of 8542.39.0060. The product is rohs non-compliant. The product has -55°c ~ 125°c operating temperature range. Moreover, the product comes in 8-soic (0.154", 3.90mm width). These sensors are sort of digital, local. In addition, it is reach affected. Furthermore, it has ai2c output. Test condition included -25°c ~ 100°c (-55°c ~ 125°c). The texas instruments's product offers user-desired applications. Its typical moisture sensitivity level is 1 (unlimited). The local sensing temperature of the product is -55°c ~ 125°c. While the highest and lowest accuracy level includes ±2°c (±3°c). Features 9 b resolution. The splendid features of the product include output switch, programmable limit, shutdown mode. The product is available in surface mount configuration. 8-soic is the supplier device package value. In addition, tape & reel (tr) is the available packaging type of the product. It has optimum voltage supply of 3v ~ 5.5v. Moreover, it corresponds to lm75, a base product number of the product. The product is designated with the ear99 code number.

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Assembly Process 05/May/2021(PCN Assembly/Origin)
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SOIC Pkg Wire Bonding Update 24/Jul/2013(PCN Design/Specification)

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