MG Chemical Epoxy Thermal Conductive Adhesive, 80 min @ +80 °C Cure, 25 ml Syringe

8329TFS-25ML MG Chemical Epoxy Thermal Conductive Adhesive, 80 min @ +80 °C Cure, 25 ml Syringe
8329TFS-25ML
8329TFS-25ML
MG Chemical

Product Information

Trade Name:
8329 TFS
Cure Time:
24 h
Operating Temperature Range:
-40 → +150 °C
Product Form:
Liquid
Viscosity Measurement:
700000cP/s
Viscosity Description:
Thixotropic
Application:
Thermal Management
Specific Gravity:
2.2
Package Type:
Dual Cartridge
Adhesive Type:
Thermal Adhesive
Minimum Operating Temperature:
-40°C
Package Size:
25 ml
Maximum Operating Temperature:
+150°C
Material Compatibility:
Metal, Plastic
RoHs Compliant
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This is Epoxy Thermal Conductive Adhesive 80 min @ +80 °C Cure 25 ml Syringe manufactured by MG Chemical. The manufacturer part number is 8329TFS-25ML. It is assigned with a trade name of 8329 tfs. Its actual cure time is about 24 h . The product has -40 → +150 °c of operating temperature range. The product is in liquid form . The viscosity measurement of the product is 700000cp/s . Moreover, it has thixotropic viscosity description . Applications Information involves thermal management. It has about 2.2 specific gravity . The package is a sort of dual cartridge. Its adhesive is of thermal adhesive type . Whereas, the minimum operating temperature of the product is -40°c. Its package size is approximately 25 ml . It has a maximum operating temperature of +150°c. It has a/an metal, plastic material compatibility .

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Datasheet(Technical Reference)
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Thermally Conductive Epoxy Adhesive (EN - SDS)(Technical Reference)

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FAQs

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You will get a confirmation email regarding your order of MG Chemical Epoxy Thermal Conductive Adhesive, 80 min @ +80 °C Cure, 25 ml Syringe. You can also check on our website or by contacting our customer support team for further order details on MG Chemical Epoxy Thermal Conductive Adhesive, 80 min @ +80 °C Cure, 25 ml Syringe.
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