MG Chemical Epoxy Thermal Conductive Adhesive, 2 h @ +65 °C, 24 (Room Temperature) h Cure, 25 ml Syringe

Enrgtech Part No: ET17974566
|
Manufacturer Part No:
8329TFM-25ML
|
Manufacturer: MG Chemical

8329TFM-25ML MG Chemical Epoxy Thermal Conductive Adhesive, 2 h @ +65 °C, 24 (Room Temperature) h Cure, 25 ml Syringe

Product Information

Trade Name:

8329 TFM

Cure Time:

24 h

Operating Temperature Range:

-40 → +150 °C

Product Form:

Liquid

Viscosity Measurement:

2000000cP/s

Viscosity Description:

Thixotropic

Application:

Thermal Management

Specific Gravity:

2.23

Package Type:

Dual Cartridge

Adhesive Type:

Thermal Adhesive

Minimum Operating Temperature:

-40°C

Package Size:

25 ml

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This is Epoxy Thermal Conductive Adhesive 2 h @ +65 °C 24 (Room Temperature) h Cure 25 ml Syringe manufactured by MG Chemical. The manufacturer part number is 8329TFM-25ML. It is assigned with a trade name of 8329 tfm. Its actual cure time is about 24 h . The product has -40 → +150 °c of operating temperature range. The product is in liquid form . The viscosity measurement of the product is 2000000cp/s . Moreover, it has thixotropic viscosity description . Applications Information involves thermal management. It has about 2.23 specific gravity . The package is a sort of dual cartridge. Its adhesive is of thermal adhesive type . Whereas, the minimum operating temperature of the product is -40°c. Its package size is approximately 25 ml . It has a maximum operating temperature of +150°c. It has a/an metal, plastic material compatibility .

Datasheet(Technical Reference)

Contains SVHC - Nonylphenol - CAS 25154-52-3(Technical Reference)

Medium Cure Thermally Conductive Adhesive (EN - SDS)(Technical Reference)

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You can order MG Chemical brand products with 8329TFM-25ML directly through our website or call us at +44 (0) 3303 800 157 or email our support team at sales@enrgtech.co.uk.

Yes. Our products in Adhesives category are shipped in lowest possible time.

You will get a confirmation email regarding your order of MG Chemical Epoxy Thermal Conductive Adhesive, 2 h @ +65 °C, 24 (Room Temperature) h Cure, 25 ml Syringe. You can also check on our website or by contacting our customer support team for further order details on MG Chemical Epoxy Thermal Conductive Adhesive, 2 h @ +65 °C, 24 (Room Temperature) h Cure, 25 ml Syringe.

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MG Chemical Epoxy Thermal Conductive Adhesive, 2 h @ +65 °C, 24 (Room Temperature) h Cure, 25 ml Syringe

8329TFM-25ML

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