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This is Adhesive for Heatshrink Boot S1125 Series manufactured by TE Connectivity. The manufacturer part number is S1125-KIT-1. It is assigned with a trade name of s1125. Its actual cure time is about 24 h . The product has -55 → +150 °c of operating temperature range. The product is in liquid form . Applications Information involves bonding. The package is a sort of bag. Its adhesive is of epoxy adhesive type . Whereas, the minimum operating temperature of the product is -55°c. Its package size is approximately 5 x 10 g . It has a maximum operating temperature of +150°c. It has a/an metal, steel material compatibility .
For more information please check the datasheets.
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