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This is manufactured by Chip Quik Inc.. The manufacturer part number is BGA0028. It is assigned with possible HTSUS value of 8536.69.4040. The product is rohs3 compliant. The product carries possible position value of 36. The product is made from highly stable and reliable fr4 epoxy glass. In addition, it is reach unaffected. The chip quik inc.'s product offers user-desired applications. Features a proto board of smd to dip type. The accepted package includes bga. The product's diameters include 0.700" l x 1.800" w (17.78mm x 45.72mm). Moreover, 0.063" (1.60mm) is the given board thickness. It has a long 4 weeks standard lead time. Its typical moisture sensitivity level is 1 (unlimited). The product proto-advantage, is a highly preferred choice for users. In addition, bulk is the available packaging type of the product. Moreover, the product is 0.012" (0.30mm). The product is designated with the ear99 code number.
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