DIP to SOIC Sockets
Two piece Adaptics that convert dual in line packages to small outline ICs format. The top is detachable from the base by way of socket contacts, allowing the two parts to be plugged and unplugged and making the surface mounting of the base much easier.
PCB: Epoxy Fibreglass FR4
Dimensions
No. Pins
DIP Pitch (in.)
SOIC Pitch (in.)
Winslow Part No.
Stock No
14
0.3
0.237
W9534P
240-6595
16
0.3
0.237
W9535P
240-6602
18
0.3
0.237
W9539P
240-6618
20
0.3
0.237
W9540P
240-6624
28
0.6
0.375
W9547P
240-6646
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
