Polyamide Hot Melt Glue
Excellent gap filling performance
Low temperature flexibility
Shock and heat resistance
Easy to apply and fast fixing
UL94V-0 Rating
Low Viscosity:
Typical uses - wire staking, cable terminal encapsulation.
Hot melt polyamide adhesives, creamy-brown, for advanced electronic potting and assembly. Glue is applied in the Polyamide Glue Gun.
Low temperature flexibility and excellent impact resistance
Ideal where substrates may be exposed to temperature extremes
Elastomeric (elongation 900%)
Can also be used to bond PC board
Tough, flexible adhesive with excellent adhesion
Tensile strength, 600PSI
Compatibility table
Description
Paper & Card
Wood
Plastic
Sheet Metals
Expanded polystyrene
Polyurethane foam
Glass & Ceramic
Gap filling
Open time (secs)
Stock numbers
Multi-purpose sticks & slugs
yes
yes
some
yes
yes
yes
no
yes
45
484-9950, 315-2716
High performance sticks & slugs
yes
yes
some
yes
yes
yes
yes
no
45
484-9900, 692-413
Very high performance slugs
yes
yes
most
yes
yes
yes
yes
no
30
315-2750
Fast set packaging sticks & slugs
yes
no
no
no
yes
no
no
no
15
484-9966, 315-2744
General Purpose sticks (coloured & clear)
yes
no
no
no
yes
yes
yes
yes
15
484-9988, 315-2772, 315-2788, 315-2794, 315-2801, 315-2817, 315-2823, 315-2839
Low Melt sticks
yes
yes
no
some
yes
no
no
no
35
692-441
Polyamide sticks, Low Viscosity
yes
yes
some
yes
yes
-
-
yes
-
217-9322
Polyamide sticks, Fire retardent
yes
yes
some
yes
yes
-
-
yes
-
217-9344
Polyamide sticks, High Viscosity
yes
yes
some
yes
yes
-
-
yes
-
217-9316
Potting/encapsulating sticks
n/a
n/a
n/a
n/a
n/a
n/a
n/a
no
60
448-6830
Note: This table should be used as a guide only. It is strongly recommended that users conduct their own tests to determine suitability.
