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Solder Pastes | Soldering Welding

New items

Loctite LF 318 96 SCA BK, Loctite

The Loctite LF 318 solder paste is a halide-free, no clean, pin testable Pb-free solder paste, formulated to have excellent humidity resistance and a broad process window, both for reflow and printing. This product has a high tack force to resist component movement during high speed placement and long printer abandon times. Good humidity resistance Clear residues for easy post-reflow inspection. Soft, non-stick, pin testable residues allow easy in-circuit testing Extended open time and tack-life leading to low wastage

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New items

291337, Multicore

RA Type Surface Mount Paste Typical uses are screen printing of PCBs (for surface mounting of chip and leadless components), fired-on ceramics, and gold/silver-plated surfaces. Methods of heating are hot air, vapour phase, infrared, hot plates and even conventional electric irons. Standard particle size available Residue may be left without cleaning Long open time (72 hours) % Tin (Sn) 62 % Lead (Pb) 40 Approx. Melting Point °C 179 Particle Size (μm) 75 max. Note Store in a cool place e.g. Refrigerator. Solder Paste - Leaded

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New items

SMD291AX10T5, ILME UK

Solder Paste no clean 63Sn/37Pb in 10cc Syringe T5 mesh. Printing speeds up to 100mm/sec Long stencil life Wide process window Clear residue Low voiding Excellent wetting compatibility on most board finishes Dispense grade Compatible with enclosed print heads Passes BONO test

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New items

SMD4300SNL10, CHIPQUIK

Solder Paste no clean Lead-Free in 10cc syringe 35g water washable w/plunger & tip. Printing speeds up to 100mm/sec Long stencil life Wide process window Clear residue Low voiding Excellent wetting compatibility on most board finishes Dispense grade Compatible with enclosed print heads Passes BONO test @1.56% RoHS II and REACH compliant

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New items

SMD291SNL, CHIPQUIK

Solder Paste no clean Lead-Free in 5cc syringe 15g w/plunger & tip. Printing speeds up to 100mm/sec Long stencil life Wide process window Clear residue Low voiding Excellent wetting compatibility on most board finishes Dispense grade Compatible with enclosed print heads Passes BONO test @1.56% RoHS II and REACH compliant

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New items

SMD291AX50T3, CHIPQUIK

Solder Paste in jar 50g (T3) Sn63/Pb37 no clean 90.25% metal. Printing speeds up to 100mm/sec Long stencil life Wide process window Clear residue Low voiding Excellent wetting compatibility on most board finishes Print grade Compatible with enclosed print heads Passes BONO test

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New items

1791137, Henkel

HF 212 Solder Paste LOCTITE HF 212 is a halogen-free solder paste that withstands the thermal demands inherent with larger assemblies. High reliability and a wide reflow process window are at the foundation of this material, ensuring its outstanding performance for the most demanding high value PCB applications. LOCTITE HF 212 is a halogen-free, no clean, low voiding Pb-free solder paste Is suitable for use with industry standard SAC ,high reliability SAC and low silver alloys SAC Suitable for high speed printing up to 150 mm/s Solderable on challenging surface finishes (CuNiZn and Copper OSP) Colorless residues for easy post-reflow inspection RS 832-9750 : HF 212 solder paste 97SC DAP RS 832-9769 : HF 212 solder paste 90iSC DAP RS 832-9762 : HF 212 solder paste 90iSC AGS RS 832-9766 : HF 212 solder paste 97SC AGS RS 832-9775 : HF 212 solder paste SAC0307 AGS Application Designed for printing, pin-in-paste and enclosed head print capability Excellent wetting to a broad range of metallization Compatible with existing halogen-free solutions Suitable for medium to large board assemblies Solder Paste - Lead Free

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New items

SMD291AX, CHIPQUIK

Solder Paste no clean 63Sn/37Pb in 5cc syringe 15g w/plunger & tip. Printing speeds up to 100mm/sec Long stencil life Wide process window Clear residue Low voiding Excellent wetting compatibility on most board finishes Dispense grade Compatible with enclosed print heads Passes BONO test

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New items

SMD291SNL10T5, ILME UK

Solder Paste no clean Lead-Free in 10cc syringe T5 Mesh SAC305. Printing speeds up to 100mm/sec Long stencil life Wide process window Clear residue Low voiding Excellent wetting compatibility on most board finishes Dispense grade Compatible with enclosed print heads Passes BONO test @1.56% RoHS II and REACH compliant

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New items

SMDLTLFP, ILME UK

Solder Paste Lead-Free Sn42/Bi57.6/Ag0.4 no clean Low Temperature Melts 138C 281F eutectic. Printing speeds up to 100mm/sec Long stencil life Wide process window Clear residue Low voiding Excellent wetting compatibility on most board finishes Dispense grade Compatible with enclosed print heads RoHS II and REACH compliant

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New items

291266, Multicore

Fine Pitch Stencilling Grade Two types of long open time SMT paste for stencilling or dispensing (with syringe). They print below 0.5mm (20 thou) pitch and meet IPC-SF-818 and Bellcore TR-NWT-0000 78 without cleaning. Approx melting point 179°C. Particle size 38-53μm. RM89 (25g/75g Syringe) For automatic or manual stencil printing 62/36/2% Tin/lead/silver as 90% of total mass content Note Store in a cool place e.g. Refrigerator. Solder Paste - Leaded

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New items

291264, Multicore

Fine Pitch Stencilling Grade Two types of long open time SMT paste for stencilling or dispensing (with syringe). They print below 0.5mm (20 thou) pitch and meet IPC-SF-818 and Bellcore TR-NWT-0000 78 without cleaning. Approx melting point 179°C. Particle size 38-53μm. RM89 (25g/75g Syringe) For automatic or manual stencil printing 62/36/2% Tin/lead/silver as 90% of total mass content Note Store in a cool place e.g. Refrigerator. Solder Paste - Leaded

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