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Showing Results For: Backplanes & Motherboards

Backplanes & Motherboards


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RS Pro
Rohs Verified
110-2545, RS Pro
13 In Stock
Check Stock & Lead Times Packaging Options
1 +
£ 48.30
5 +
£ 46.36
10 +
£ 44.44
RS Pro
Rohs Verified
110-2444, RS Pro
1 In Stock
Check Stock & Lead Times Packaging Options
1 +
£ 136.58
2 +
£ 132.48
5 +
£ 128.39
Vero Technologies
Rohs Verified
222-63630, Vero Technologies
Pre Order
Check Stock & Lead Times Packaging Options
1 +
£ 161.72
Vero Technologies
Rohs Verified
222-63631, Vero Technologies
Pre Order
Check Stock & Lead Times Packaging Options
1 +
£ 77.63
10 +
£ 68.78
20 +
£ 61.09
Vero Technologies
Rohs Verified
222-29824, Vero Technologies
2 In Stock
Check Stock & Lead Times Packaging Options
1 +
£ 76.28
5 +
£ 72.47
10 +
£ 68.65
Vero Technologies
Rohs Verified
222-2470, Vero Technologies
2 In Stock
Check Stock & Lead Times Packaging Options
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£ 207.48
5 +
£ 197.11
10 +
£ 186.74
Rohs Verified
RS_110-2444, RS PRO
Pre Order
Check Stock & Lead Times Packaging Options
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£ 119.67
2 +
£ 116.08
5 +
£ 112.49
Rohs Verified
RS_110-2545, RS PRO
Pre Order
Check Stock & Lead Times Packaging Options
1 +
£ 42.32
5 +
£ 40.61
10 +
£ 38.92
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New Items
New items
110-2545, RS Pro

110-2545, RS Pro

Double-Sided, Non-Allocated Motherboards Complete flexibility of positioning of Vdc or earthing. Four voltage lines available. Option to connect power supply using 6.3 mm terminal type faston or M3 thread. Choice of various widths and pitches of connectors. Row b can be used as a 0 V reserve line, in order to minimise crosstalk on rows a and c. Contacts 1, 2, 31 and 32 are allocated via a 2.54 mm pitch connection. Other contacts can be allocated by wiring or wrapping. Rows a, b and c can be connected together using strap connectors (designed to connect DIN connector pins). Boards feature high-quality foil laminate holes with varnish to avoid solder bridges. Material: epoxy glass in accordance with BS 4584 EP-GC-CU-3 (FR4) Nominal thickness: 1.6 mm Track thickness: 35 μm Coating: - copper:  25 μm - tin plating:  8 μm Self-extinguishing capability (empty board): UL 94-V0 Stock type Pitch number Length width no. connectors (mm) of positions (mm) (mm) 110-2523 96 / 96 20.32 21 420.8 128.6 110-2539 96 / 96 20.32 10 212.5 128.6 110-2545 96 / 96 20.32 5 95.7 128.6 156-7885 96 / 96 15.24 28 425.9 128.6 508-0893 96 / 96 15.24 14 212.5 128.6 PC / VME Bus Boards PC Compatible Prototyping Boards Prototyping boards manufactured from epoxy glass material to BS 4584 part 3 or 16. Card thickness is 1.6 mm. Copper is 305 g/m (1 oz/ft). Edge connector fingers are gold plated to a thickness of 1.5 microns. 1.0 mm (0.040 in.). Diameter holes are pre-drilled on a 2.54 mm (0.1 in.) matrix. Microboard Pattern Incorporates, on the component side of the card, a colander ground plane for maximum screening and glitch free high speed operation, and complete solder mask protection.
New items
222-2470, Vero Technologies

222-2470, Vero Technologies

Eurocard Backplanes, Double-Sided Double sided backplanes 3U high with pth for high reliability which will accept DIN41612 connectors. Suitable for use with subracks to IEC297-3. 96//96-way suitable for high speed logic systems where screening is required between each signal line. Can also be used for slower applications with a maximum of 84 seperate signal lines by breaking the 0V commoning line in the end position Supplied with 2 insulated mounting strips PC / VME Bus Boards PC Compatible Prototyping Boards Prototyping boards manufactured from epoxy glass material to BS 4584 part 3 or 16. Card thickness is 1.6 mm. Copper is 305 g/m (1 oz/ft). Edge connector fingers are gold plated to a thickness of 1.5 microns. 1.0 mm (0.040 in.). Diameter holes are pre-drilled on a 2.54 mm (0.1 in.) matrix. Microboard Pattern Incorporates, on the component side of the card, a colander ground plane for maximum screening and glitch free high speed operation, and complete solder mask protection.
New items
222-29824, Vero Technologies

222-29824, Vero Technologies

Single-Sided Eurocard Backplanes A 64-way single-sided Eurocard backplane suitable for use with 64//96 (a/c) DIN 41612 indirect edge connectors, in conjunction with Eurocard sub-racks to DIN 41494, e.g. the RS eurocard sub-rack system (except 4HP and 10HP card fronts).,Dimensions: Height 3U. Width 84HP. Pitch 0.6 in (15.24 mm). Lines 1, 2, 31 and 32 (a and c) are fully bussed for 3 rail and 0V power distribution.The absence of a grounding plane makes this backplane ideal for slow-speed non critical applications.,Mounting arrangements onto the RS sub-rack system is as depicted for the double-sided type Supplied with 2 insulated mounted strips PC / VME Bus Boards PC Compatible Prototyping Boards Prototyping boards manufactured from epoxy glass material to BS 4584 part 3 or 16. Card thickness is 1.6 mm. Copper is 305 g/m (1 oz/ft). Edge connector fingers are gold plated to a thickness of 1.5 microns. 1.0 mm (0.040 in.). Diameter holes are pre-drilled on a 2.54 mm (0.1 in.) matrix. Microboard Pattern Incorporates, on the component side of the card, a colander ground plane for maximum screening and glitch free high speed operation, and complete solder mask protection.
New items
110-2444, RS Pro

110-2444, RS Pro

Microbus with earth plane This Microbus is designed for use with DIN 41612 64 // 96 or 96 // 96 connectors. Pins 1 and 32 on rows a and l are for 0 V with full 0 V display panel on one side of the plate. Pins 2 and 31 on rows a and c are for Vdc, which therefore clears 56 separate signalling lines. The width of the plate is from 42 → 84 E. The female 64 // 96 and 96 // 96 solder or wrap connectors are ordered separately. High reliability thanks to the metal holes. Minimum crosstalk. DIN 41494 (KM6-II) compatible. Protective lacquer to prevent solder bridges. Material: Epoxy glass Thickness of copper: 35 μm Finish - applied copper:  25 μm - tin plating:  8 μm Selection guide ref. APW connector Pitch width no. of slots Length 222-26034 96 / 96 15.24 42E 14 213 mm 222-26035 96 / 96 15.24 60E 20 304.4 mm 222-2470 96 / 96 15.24 84E 28 426.3 mm 222-22847 96 / 96 20.32 84E 21 426.3 mm 222-26025 64 / 96 15.24 84E 28 426.3 mm 222-27569 64 / 96 20.32 84E 21 426.3 mm PC / VME Bus Boards PC Compatible Prototyping Boards Prototyping boards manufactured from epoxy glass material to BS 4584 part 3 or 16. Card thickness is 1.6 mm. Copper is 305 g/m (1 oz/ft). Edge connector fingers are gold plated to a thickness of 1.5 microns. 1.0 mm (0.040 in.). Diameter holes are pre-drilled on a 2.54 mm (0.1 in.) matrix. Microboard Pattern Incorporates, on the component side of the card, a colander ground plane for maximum screening and glitch free high speed operation, and complete solder mask protection.
FAQs
We offer free shipping for orders over £200 if delivery is in the UK. All other orders in the UK, shipping from £7.99 depending on the weight and measurement. Mainland Europe shipping charges start from £25. For all other countries shipping charges start from £50 for products like Backplanes & Motherboards and all others.
You can email us directly at sales@enrgtech.co.uk or via our website for any queries regarding Backplanes & Motherboards or any other product.
This depends on the Backplanes & Motherboards individual product and information that can be found on our website.
Yes, we offer special discounts on orders above £200 for Backplanes & Motherboards and all other products.
UK orders normally take between 2/3 working days. International orders normally take between 3/5 working days for all products including Backplanes & Motherboards.
Yes. We keep updating our stock frequently and if a product like Backplanes & Motherboards is not in stock then we will let you know.